[신소재공학]반도체 공정(process flow)

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반도체 공정의 흐름(process flow)에 관해 ppt 자료로 만든 것입니다.
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목차

The chip making process
Making the Wafer
The Mask Making Process
Epitaxy
Photolithography process
Oxidation & Exposure
Etch & strip
Diffusion & Implant
Deposition
Oxidation
Interconnect - Vias
Interconnect – Metallization
Chemical Mechanical Planarization
Interconnect – Layers
Inspection & Measurement
Yield Impact
Test, Assembly & Packaging
Wafer Probe
Memory repair
Assembly & Packiging
Package Test

본문내용

Making the Wafer

The process
-A seed crystal is suspended in a molten bath of silicon
-It is slowly pulled up and grows into an ingot of silicon
-The ingot is removed and ground down to diameter
-The end is cut off, then thin silicon wafers are sawn off (sliced) and polished

Epitaxy
The growth of an ultra-pure layer of crystalline silicon
Approx 3% of wafer thickness
Contaminant-free for the subsequent construction of transistor

참고 자료

주로 외국 사이트에서 발췌 하였습니다.